Cinterion have released the EHS5 module which represents a new milestone in scalable machine-to-machine communication.
Offering smart connectivity for industrial applications, the EHS5 delivers highly efficient 3G communication in the same ultra-compact footprint as the (‘2G’ GSM/GPRS) BGS2 module.
The EHS5 is an ideal solution for M2M applications moving to 3G technology with a focus on long-lasting, future-proof and cost efficient M2M applications. Offering a backward and forward compatible footprint, its multi design capability offers seamless migration and unmatched flexibility to choose frequency bands and global roaming whenever needed.
Powered by Intel’s latest HSPA+ baseband, the next generation of the award-winning Evolution platform features high speed data communication with 7.2 Mbps (max) in the downlink and 5.76 Mbps (max) in the uplink.
The tiny EHS5 comes in Cinterion’s unique LGA (Land Grid Array) package perfectly suited to the manufacturing needs of small, high-volume M2M devices with a focus on reliable and efficient processes. EHS5 supports voice and data communication and best in class low power consumption incorporated with common industrial interfaces such as USB and serial interfaces.
EHS5 is available in two variants: EHS5-US (850/1900 MHz) for North America, and EHS5-E (900/2100 MHz) assuring global coverage.
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